خلاصه: Discover the advanced Ultrasonic Semiconductor Wafer Coating technology by FUNSONIC, designed for precise and uniform wafer coating. This equipment features a max power of 1-15W and spray uniformity ≥95%, ensuring high-quality chip bonding adhesives and films. Ideal for photolithography, protective coatings, and functional applications.
ویژگیهای مرتبط با محصول:
Intelligent Ultrasonic Precision Coating Machine desktop Type FS620 with a spray nozzle operating frequency of 20-200Khz.
Nozzle power ranges from 1-15W, providing precise control over coating thickness.
Continuous spraying volume max of 0.5-10ml/min for efficient wafer processing.
Effective spraying width of 2-20mm, ensuring uniform application.
Spray uniformity ≥95% and solution conversion rate ≥95% for consistent results.
Dry film thickness ranges from 20nm-100μm, suitable for various applications.
XYZ three-axis exercise mode with independently programmable controls for flexibility.
FUNSONIC spraying control system with PLC control and a 13.3-inch full-color touch screen for easy operation.
سوالات:
What is the spray uniformity of the Ultrasonic Semiconductor Wafer Coating equipment?
The spray uniformity is ≥95%, ensuring consistent and high-quality coating application.
What are the key parameters to consider for optimal spraying performance?
Key parameters include ultrasonic frequency, spraying speed, coating thickness, and material properties like viscosity and surface tension.
What applications is the Ultrasonic Semiconductor Wafer Coating suitable for?
It is suitable for coating photosensitive layers in photolithography, applying protective coatings, and functional coatings with specific electrical or optical properties.